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Entry level ARM M33 microcontrollers optimized for power efficiency

Entry level ARM M33 microcontrollers optimized for power efficiency

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By Nick Flaherty



Renesas Electronics has launched two new families of microcontroller optimized for power efficiency using the ARM Cortex-M33 core.

The 100MHz RA4E2 Group and 200MHz RA6E2 Group are optimized to provide best-in-class power efficiency along with ARM TrustZone security. The families are aimed at sensing, gaming, wearables and appliances and are launched at the Embedded World (EW2023) exhibition in Germany today

With 128 Kbyte and 256 Kbyte flash options and 40 Kbytes of SRAM, the two groups integrate options for on-chip CAN FD, USB, QSPI, SSI and I3C interfaces and offer an easy upgrade path to other members of the RA Family.

The RA4E2 and the RA6E2 are the most cost-effective members of the RA family with integrated CAN FD, and are available with small package options including a space saving 4 x 4 mm 36-pin BGA and a 5 x 5 mm 32-pin QFN to satisfy the needs of cost-sensitive and space-constrained applications.

All RA devices are supported by the Renesas Flexible Software Package (FSP) that includes highly efficient drivers and middleware to ease the implementation of communications and improve functionality of peripherals. The FSP’s GUI simplifies and accelerates the development process. It enables flexible use of legacy code as well as easy compatibility and scalability with other RA family devices. Designers using FSP also have access to the full Arm ecosystem as well as the Renesas partner network.

RA4E2 MCU Group

The RA4E2 Group includes five different options, spanning from 32-pin to 64-pin packages as small as 4 x 4mm, and 128kB of flash memory along with 40kB of SRAM. The RA4E2 devices have active power consumption of 82 µA / MHz while executing from Flash at 100 MHz. They have an extended operating temperature range of -40/105°C. Integrated communications options including USB 2.0 Full-Speed Device, SCI, SPI, I3C, HDMI CEC, SSI, and CAN FD, while other blocks include internal oscillator, abundant GPIO, advanced analog, low-voltage detection and internal reset function

RA6E2 MCU Group

The 200MHz RA6E2 Group spans ten parts from 32-pin to 64-pin packages as small as 4mm x 4mm, and from 128kB to 256kB of flash memory along with 40kB of SRAM. The low power operation consumes 80 µA / MHz in active mode while executing at 200 MHz, with the same connectivity options as the RA4E2 group.

Renesas has designed a full Add-on Voice User Interface (VUI) Solution using the RA6E2 MCU and other compatible devices from the Renesas portfolio. This solution is modular and can easily be added to any application needing a Voice User Interface, such as smart thermostats or appliances. The RA6E2 MCU handles all tasks without burdening the host MCU.

“Our RA Family continues to exceed expectations by delivering market-leading performance, features, ease-of-design and value,” said Roger Wendelken, Senior Vice President in the IoT and Infrastructure Business Unit at Renesas. “The new RA4E2 and RA6E2 Groups are exceptional examples of why many customers have adopted the RA family as their MCU family of choice. We’re confident that these parts will hit the sweet spot for a wide range of applications, and that many designers will look to the RA family for future designs as well.”

“Over 90% of processors shipped are microcontrollers. The applications that use these MCUs are exceptionally varied,” said Tom Hackenberg, Principal Market and Technology Analyst for Computing and Software at the Yole Group. “By continuing to expand its RA offerings, Renesas can address more customers in more markets with optimized parts for this wide range of specific applications.”

renesas.com/win

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