The eGaN FETs and ICs are traditionally sold as singulated chip-scale devices with solder bars or solder bumps, but chip-scale packaging is a more efficient form of packaging that reduces the resistance, inductance, size, thermal impedance, and cost of power transistors.
Shipping as wafers also allows for easier integration in customer power system sub-assemblies, further reducing device interconnect inductances and the interstitial space needed on the printed circuit board (PCB). This increases both efficiency and power density while reducing assembly costs.
“We have listened to our partners and are pleased to offer our industry-leading GaN products in wafer form that can accommodate a variety of assembly techniques and applications,” said Alex Lidow, CEO and co-founder of EPC.
EPC is offering eGaN power devices in wafer form either with or without solder bumps. Extra services such as wafer thinning, metallization of the wafer backside, and application of backside coating tape are also available.
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