ESIA calls for more funds and support from European Chips Act 2.0
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The European Semiconductor Industry Association (ESIA) has asked the European Union to create a Chips Act 2.0, speed up the distribution of subsidies and create a “Chip Envoy” to champion the sector.
An ESIA statement said European chip policy should include fewer export restrictions, according to a Reuters report.
ESIA represents all the major European chip companies – Infineon, NXP, ST and chipmaking equipment company AMSL as well as research institutes, IMEC, Fraunhofer and CEA-Leti. It called for an “immediate Chips Act 2.0.”
The first European Union Chips Act, came into force in September 2023. The plan had a budget of €43 billion that comprised national governments’ funds but with the goal of doubling Europe’s share of global chip manufacturing to 20 percent by 2030.
European Chips Act amended, softened, approved
Under the first European Chips Act the European Commission has recently approved German plans to provide the support for the construction and operation of a wafer fab with half of an estimated cost of €10 billion. Ground was broken in August for European Semiconductor Manufacturing Co. (ESMC).
However, a US$32 billion project planned by Intel to open up two wafer fab buildings in Magdeburg, Germany, could be under threat. Intel has started making losses and is considering its strategic options. The time line for Intel in Dresden has already been pushed back with plans for production not scheduled for four or five years after the European Union signs of on subsidies of about US$10 billion to be provided by the German government.
Elsewhere ST and Globalfoundries have agreed to collaborate on a subsidized wafer fab near Grenoble.
The ESIA also was critical of the lack to support given to chip companies who are finding access to Chinese markets blocked for many of their products.
“A more positive approach to economic security is required which is based on support and incentives, rather than a defensive approach that relies on restrictive and protective measures,” Reuters quoted the ESIA saying in its statement.
Related links and articles:
News articles:
Intel considers foundry split, fab cancellations
€5 billion subsidy approved as ESMC breaks ground for Dresden fab
ST looks at joint European wafer fab with GlobalFoundries
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