EU commission, NXP, Infineon sign agreement on cyber security

EU commission, NXP, Infineon sign agreement on cyber security

Business news |
By Christoph Hammerschmidt

The central element of the cooperation with the EU is the task of establishing a strategic alliance for cyber security. NXP said it has been actively involved in building the ECSO; the chipmaker also has brought significant content of its R&D Security Roadmap into the partnership. The same holds true for Infineon; both semiconductor vendors hold massive security IP for use in application fields like IoT and automotive. The members list also includes STMicroelectronics, Thales, Airbus, Bosch and Siemens, to name a few.

Within the scope of its research and innovation program Horizon 2020, the EU will provide research funds of €450 million. In return, the ECSO members will jointly invest some €1.3 billion into the development of innovative and reliable cyber security solutions, products and services. “Secure components are crucial for a successful market development of innovative applications such as the IoT as well as intelligent systems and technologies that will go into action in automated driving”, said Ulrich Huewels, NXP Senior Vice President and General Manager Secure Card Solutions.

NXP said it is committed to Europe’s proven certification plan which – among others – aims at establishing common security criteria like those already in place in the commercial IT markets.

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