EU project targets breakthrough in space imaging sensing
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A consortium financed by the European Union (EU) is developing advanced high-resolution image sensors that could be utilised in various space missions, including Earth observation, planetary exploration, and scientific research.
The three-year Technology for European iNdependence in Space Image Sensor (TENSIS) project will focus on developing advanced CMOS imaging sensors within the EU. Its objective is to establish a strategic competitive advantage for European prime contractors and equipment manufacturers while minimising reliance on critical technologies and capabilities from outside the EU.
Launched on 11 February 2025 during an inauguration event at the Teledyne e2v facilities in Saint-Egrève, Grenoble Area, France, the project aims to validate a scalable, large-area, high-resolution, radiation-tolerant, customisable, and affordable 180nm CMOS detector. It will feature key technical specifications including a 24K x 16K stitched CMOS matrix of 400 MPixels. Additionally, a smaller 4K x 4K stitched CMOS array will be designed and manufactured.
The project comprises several industrial partners, each of whom brings valuable expertise. Teledyne e2v Semiconductors SAS (France) and Teledyne Innovaciones Microelectronicas SL (Spain) will oversee the project and design the detectors, including the pixel, while imec (Belgium) will manage the development of the optical stack on top of the CMOS detector, including filters and optical microlenses.
Airbus Defence and Space SAS (France) will lead the development of test equipment and evaluate the performance of the detector prototypes. Alter Technology Tüv Nord (Spain) will validate the smaller 4K x 4K detector for use in a space environment.
“TENSIS will result in the development of advanced image sensors for space that are high-resolution and durable against space conditions,” says Marc Iliozer, Project & Engineering Director at Teledyne e2v. “The project will help establish strategic capability in Europe and ensure independence in space technology for years to come.”
The project will run until 31 December 2027. The 24k x 16k stitched CMOS array is expected to reach Technology Readiness Level (TRL) 6, with a prototype sensor tested in a relevant environment. The 4k x 4k CMOS detector will reach TRL7, taking it one step closer to final product development.
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