European 3D TSV Summit to add business focus
SEMI said this reflects that, after a long period of development, through-silicon-via (TSV) technology is transitioning to the commercialization stage and delivering higher performance, lower power consumption and reduced footprint products to enable overall smarter system integration.
The use of TSVs and 3D-stacking of ICs is coming to market on a broad front that covers memories, FPGAs, MEMS and image sensors.
Memory component companies SK Hynix, Micron and Samsung are manufacturing engineering samples or ramping up the production of stacked memories with TSV. Bosch, a leading MEMS company, is proposing 3-axis accelerometers with TSV. Sony is manufacturing 3D-stacked backside illuminated image sensors with TSV in the logic die. Xilinx, a pioneer of TSV with its 2.5D Virtex-7 FPGAs in 28nm silicon, has announced their next-generation FPGA products Kintex and Virtex Ultra Scale in 20nm and 16nm die stacked on an interposer.
The event is set to include 20 invited speakers from design groups, IDMs, packaging companies as well as equipment and materials suppliers are set to discuss business and technological issues pressing the industry – including cost of ownership, business models, supply chain, manufacturability and other technological aspects.
The previous event of the same title, held in January 2014, attracted 330 participants from 21 countries. The conference is accompanied by an exhibition and the opportunity to visit CEA-Leti’s TSV-capable 300mm wafer clean room.
Related links and articles:
www.semi.org/european3DTSVSummit
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