European chip industry throws switches to regain global competitiveness
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eeNews Europe
An extremely capital-intensive transition to the 450mm wafer technology (More Moore) and an application-oriented design and manufacturing approach could be the new route. At the recent International Strategy Symposium (ISS), organized by industry association SEMI Europe, prominent representatives from European chipmakers, research institutions and equipment providers finally found a common denominator that satisfied all participants – the industry could and should unfold activities in both directions, the panel suggested.
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