EUV gets $500M center

EUV gets $500M center

Technology News |
By eeNews Europe

The move is the latest sign EUV will finally make its way into production fabs, albeit probably not until 2018 or later.

The Advanced Patterning and Productivity Center (APPC) will be located at the Colleges of Nanoscale Science and Engineering (CNSE) in Albany, N.Y.  It will have a ASML NXE:3300 EUV scanner and a staff of about 100 researchers.

“I consider this a very positive sign,” said Gary Patton, chief technology officer and senior vice president of worldwide R&D at Globalfoundries. EUV “has gone through a lot of ups and down from unrealistic exuberance four or five years ago to pessimism two or three years ago to our current thinking it’s going to be real pretty soon,” Patton said.

EUV could be ready for use in production fabs "as early as 2018-2019," said Patton.

The center will work on the full range of outstanding issues to make EUV viable for production fabs including ecosystem elements such as masks, resists, and EDA software. Partners including IBM and Tokyo Electron are expected to take part in the work.

“EUV technology has emerged from R&D and the new center will meet the rising demand to commercialize this technology and put it in the hands of end users,” said Gishi Chung, a senior vice president at Tokyo Electron, speaking in a press statement.

The much delayed EUV effort is one of the most technically ambitious projects geared at driving progress toward making smaller chips. The work has required billions of investments from big chip makers including Intel and TSMC.

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