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EUV lets TSMC shrink chip manufacturing process to 6nm

Technology News |
By Peter Clarke


The N6 process makes use of extreme ultraviolet (EUV) lithography capabilities gained from the N7+ process. TSMC claims that N6 delivers 18 percent higher logic density over N7 but with design rules that are fully compatible with N7.

The N6 process is scheduled for risk production in 1Q20 and will address the same leading-edge applications that the N7 processes are serving in 2019; ranging from high-to-mid end mobile, consumer applications, AI, networking, 5G infrastructure, GPU, and high-performance computing.

Related links and articles:

www.tsmc.com

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