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Fairchild Semiconductor kicks off power seminars program in Europe

Fairchild Semiconductor kicks off power seminars program in Europe

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By eeNews Europe



The seminars will also include 13 cities in the Americas and four in Asia in early 2014.

The power seminar series – themed ‘Engineering Energy Efficiency’ – is a comprehensive one-day seminar that provides technical and practical presentations that combine new, advanced power supply concepts, tutorial review of basic design principles, and ‘hands-on’ real-world application examples.

The focus of Fairchild power seminars is on technologies and techniques, not products. The new topics for 2013-2014 range from:

  • advanced or emerging power technologies (critical design issues of LLC resonant converters, current shaping strategies for buck PFC),
  • design issues in key applications (low-voltage dc-dc converters, high power HB-LEDs),
  • design examples (rapid-iteration flyback design)

The seminars are ideal for engineers looking for the latest advancements in power supply design, as well as those looking for a refresher. The attendees will receive in-depth theoretical and practical discussions on each topic and pros and cons of different solutions to improve energy efficiency and system performance. Each of the presentations is accompanied by a technical paper with the full in-depth treatment of the topic for reference.  

The 2013-2014 Power Seminar technical sessions include:

The LLC Resonant Converter: Design Issues and Solutions – highlighting the critical design issues of the LLC resonant converter including synchronous rectification and discussing potential solutions to solve them.

Driving HB-LEDs in High-Power Industrial Fixtures – addressing some of the specific challenges designers face when considering power supply design solutions for HB-LED lighting applications.

Current Shaping Strategies for Buck Power Factor Correction (PFC) – discussing two possible control techniques for a buck PFC converter, where the input current is indirectly shaped by shaping the inductor current.

Improve Flyback Design Performance with a Rapid Iteration Approach – highlighting capable design software that enables an engineer to optimize a circuit by comparing the performance of many different design alternatives in a short time.

Evolution in Packaging for Optimum Efficiency and Size in Low Voltage DC-DC Applications – focusing on the advantages of co-packaging two power MOSFET die along with a gate driver IC die to form a low voltage, high current multi-chip module (MCM) synchronous buck power stage.

Visit Fairchild Semiconductor at www.fairchildsemi.com

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