Fan-out wafer-level packaging market to double in 2018
Apple packaged its A10 application processor in TSMC’s fan-out technology and Yole predicts the market for the total FOWLP equipment market will grow from about $200 million in 2017 to nearly $400 million in 2018. Similarly, Yole reckons the FOWLP total materials market will be about $55 million in 2017 and exceed $100 million in 2018.
Market for FOWLP manufacturing equipment from 2015 to 2021. Source: Yole Developpement.
The period 2015 to 2016 also saw FOWLP adoption spreading from mobile/wireless and automotive to MEMS, RF and medical applications, Yole asserts.
Market for materials for FOWLP from 2015 to 2021. Source: Yole Developpement.
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