Fine pitch bump adapters turn TSSOP, QFP and other fine-pitch devices into SMT
In addition to simple circuit correction, other active or passive components can be added to the adapter to facilitate a more complex or custom adaptation via the open space available at the top of the adapter board. This extra available space allows for easy conversion of the original design saving both time and money. The fine pitch bump adapter boards are 0.813 mm thick FR4 or Rogers 370 HR, with 1/2 oz. copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG). The adapters can operate up to 105°C for FR4 and 130°C for lead-free. The adapters are available in tape and reel for high speed SMT assembly and can be manufactured for RoHS compliance.
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