Fine pitch socket for co-packaged optical modules

Fine pitch socket for co-packaged optical modules

Business news |
By Nick Flaherty

Swiss connector giant TE Connectivity has developed a fine pitch socket interposer technology for co-packaged optics and optical modules.

The technology was developed with Ranovus for the Odin 800Gbps Analog-Drive co-packaged optics (CPO) 2.0 architecture.

TE’s CPx co-package fine pitch socket interposer technology can enable integration of miniature optical engine formfactors in extreme close proximity to a packaged ASIC die. This can provide an excellent signal integrity transition to the ASIC as required for minimal equalization or in the case of an Analog-Drive architecture, reducing the need for complex equalization.

The Ranovus and TE co-packaging technologies are now being demonstrated in prototype CPO systems.

“It is gratifying to see the progress that Ranovus and TE have made in advancing the co-packaging state-of-the-art with this fully functioning co-packaging assembly.  Ranovus’ low power high performance ultra dense Odin silicon photonics engine fully leverages’s TE’s CPx fine pitch electrical interconnect socket technology by taking advantage of the density and excellent signal integrity performance”, said Nathan Tracy, Technologist at TE.  “Co-packaging is all about pushing the technology envelope and both Ranovus and TE have continued to do that in ways that can enable power reductions and density gains with a serviceable integrated assembly that can enable practical implementations.”

Co-packaged optics combines multiple 100 Gbps PAM4 optical input/output (I/O) for Ethernet switch and ML/AI silicon in a single packaged assembly to significantly reduce the cost and power consumption of the complete system.

“We are pleased to demonstrate the flexibility of our Odin 800Gbps optical interconnect platform in combination with the novel CPx fine pitch socket interposers, with superior signal integrity, developed by TE,” said John Martinho, SVP R&D of Ranovus, which has a development lab in Nuremberg, Germany. “We have been at the forefront of the Co-Packaged Optics initiative since 2018 and are thrilled to be able to offer our customers the flexibility of co-packaging our Odin IP cores with TE’s fine pitch sockets for both CPO and optical module applications.”

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