First cloud-enabled, collaborative environment for electromechanical development
Cadence Design Systems and Dassault Systèmes have extended their ongoing strategic partnership by integrating the AI-driven Cadence® OrCAD® X and Allegro® X PCB design platforms with Dassault Systèmes’ extended 3DEXPERIENCE Works Portfolio aiming to transform the development of electromechanical systems.
The 3DEXPERIENCE® Works portfolio connects people, data and applications across the entire product development process. It enables SOLIDWORKS 3D design software users to collaborate design, simulation and manufacturing through to marketing and governace. The partnership enables best-in-class collaboration for existing and future SOLIDWORKS 3D design software customers to carry out continuous development across PCB, 3D mechanical design and simulation. The cloud-enabled offering provides joint customers an easy-to-use, end-to-end system for next-generation product development, enabling an up-to-5x reduction in design turnaround time for electromechanical systems design.
Electrical and mechanical engineers are now able to accelerate the end-to-end mechatronics system development process while optimizing designs for performance, reliability, manufacturability, supply resilience, compliance and cost. The new integration offers a seamless and scalable electromechanical products development experience to customers of different sizes, from startups to enterprises.
“Any companies developing electromechanical products today need a synergistic solution in order to avoid time-to-market delays,” said Kimball Cluff, executive vice president of Software Sales at GoEngineer, a leading provider of mechanical and electrical design and analysis systems from Dassault Systèmes and Cadence. “This new cloud-enabled offering from Cadence and Dassault Systèmes provides electrical and mechanical design teams with a proven and easy-to-deploy collaborative development platform.”
“Every industry is experiencing exploding product complexity due to electrification, AI/ML, security, connectivity and sustainability requirements,” said Tom Beckley, senior vice president at Cadence. “Cadence is the leader in developing AI tools for advanced IC packaging and PCB design. With Dassault Systèmes’ powerful 3DEXPERIENCE platform, customers can now design using a best-in-class package that enables collaboration across PCB and 3D mechanical design.”
“Today’s experience economy, where the value of a product comes from its usage, drives exponential demand for connected evolutive electromechanical products. Companies are shifting to experience thinking in their product development processes. Our fast-developing partnership with Cadence empowers our customers to make this shift,” said Philippe Laufer, Executive Vice President Global Brands, Dassault Systèmes.
The joint offering will be available in the second quarter of 2024.
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