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First COM-HPC board with Tiger Lake processors

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By Nick Flaherty


Congatec has launched its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module based on Intel’s 11th generation Tiger Lake processor.

COM-HPC is the latest COM Express specification to boost high performance computing (HPC) designs, providing more bandwidth. 

“For the first time, design engineers now have the choice to go either with COM Express or COM-HPC,” said Andreas Bergbauer, Product Line Manager at congatec. “Each provide unique benefits for example, we have an improved next-gen connector for COM Express that is expected to offer better bandwidth capacities compared to what was available in the past. This is essential information for engineers thinking about utilizing the high bandwidth interfaces such as PCIe Gen 4. Engineers choosing COM-HPC will benefit from by far more high-speed interfaces delivered over 800 signal pins in total. This is almost twice as many pins as COM Express Type 6 modules deliver with 440 pins.”

Typical applications range from embedded systems and edge computing nodes to network hubs, and local fog data centers to core network appliances, as well as ruggedized central cloud data centers for critical government applications.

“congatec’s modules based on the 11th Gen Intel Core processors feature high-performance CPU/GPU compute with integrated AI acceleration for critical applications that demand high-speed processing, and computer vision,” said Gerhard Edi, CTO at congatec.

The COM-HPC Client size A module conga-HPC/cTLU as well as the COM Express Compact conga-TC570 support PCIe x4 in Gen 4 quality to connect external peripherals. Besides PCIe Gen 4, the Computer-on-Modules also offer USB 4.0, which is based on Intel’s Thunderbolt technology and supports data transfer rates of up to 40 Gbit/s and tunneling of PCIe 4.0 as well as DP-Alt mode supporting video signals of up to 8k resolution with 10-bit HDR at 60 Hz.

Designers can also use 8x PCIe Gen 3.0 x1 lanes. Where the COM-HPC module offers latest 2x USB 4.0 and 2x USB 3.2 Gen 2 and 8x USB 2.0, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification. Sound is provided via I2S, SoundWire by COM-HPC, and HDA by COM Express modules. Comprehensive board support packages are provided for all leading OS’s like Linux, Windows and Chrome, as well as hypervisor support from Real‑Time Systems.

congatec.com/11th-gen-intel-core/

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