The three new kits are the first among nearly 40 to be delivered by Xilinx and ecosystem members supporting embedded and high-speed connectivity applications, as well as markets such as automotive, broadcast, consumer, industrial and communications with reference designs that come with each kit.
Each kit supports the FMC specification, a key Targeted Design Platform enabler defined by VITA 57 that delivers an industry standard daughter card form factor, connector and modular interface to an FPGA located on a base board, and a wide range of FMC cards for the Virtex-6 boards can be used with the Series-7 platforms.
The Kintex-7 FPGA KC705 Evaluation Kit provides a flexible framework for designing higher-level systems using DDR3, Gigabit Ethernet, PCI Express, and other serial connectivity standards. An AMS header lets designers explore the AMS technology and see how the feature can trim BOM cost.
The Kintex-7 FPGA DSP Kit co-developed with Avnet Electronic Marketing features the Kintex-7 FPGA KC705 board and includes an integrated high-speed analog FMC to interface to real-world signals. Featuring dual-channel 800 MSPS 16-bit digital-to-analog converters (DACs) and dual-channel 250 MSPS 14-bit analog-to-digital converters (ADCs), the High-Speed Analog module delivers exceptional throughput when combined with the massively parallel processing bandwidth of the DSP48E1 arithmetic processing engines in the Kintex-7 FPGA. Data paths to and from the DSP slices can be created and integrated into systems using industry-standard AXI4 interface conventions.
The Virtex-7 FPGA VC707 Evaluation Kit gives designers an easy starting point for evaluating and leveraging devices that deliver breakthrough performance, capacity and power efficiency. The kit is the optimal choice for advanced systems that need the highest performance and highest bandwidth connectivity. It speeds the development of designs that can leverage the full breadth of Virtex-7 FPGAs, all of which offer maximum power efficiency—requiring 50% less power than previous generation devices.
“Xilinx’s 7 series families take FPGA technology further into SoC applications that were never possible before without costly and time-consuming ASIC or ASSP development,” said Vin Ratford, Senior Vice President, World Wide Marketing, Xilinx. “Xilinx is executing a record-breaking rollout of its 28nm generation, which means customers now have access to base and domain platforms as well as a range of ecosystem offerings for evaluating, developing and deploying systems that take advantage of the low-power and flexibility 7 series FPGAs bring to the table.”