First integrated tool for full system thermal characterization and analysis
T3Ster is an advanced thermal transient tester for semiconductor device packages and LEDs while FloTHERM is the de-facto standard for electronics thermal simulation and analysis to predict airflow, temperature and heat transfer throughout electronics equipment including components, boards, and entire systems. The interface between T3Ster and FloTHERM seamlessly creates accurate thermal simulation models and is the only JESD51-14 compliant solution available on the market today.
Increased design complexity and smaller form factors create heat management problems which represent one of the biggest challenges in electronics today. Temperature is understood to be the key accelerator in the majority of reliability failures and IEEE Standard 1413 recognizes the need for accurate thermal data at all levels of a system’s implementation.
Analysis, typically based on vendor datasheets, often provides insufficient results and clear, accessible, and reliable data relating to thermal characteristics upstream and downstream is critical. The combined methodology allows manufacturers to optimize their LED and IC package designs for effective heat dissipation. Once the device prototype is built, they can then characterize the device from a thermal perspective and build accurate models for use in FloTHERM thermal software simulations at both the sub-system and full system levels. Finally, systems integrators can further verify their heat management solutions with physical measurements using the T3ster hardware.
“As LEDs become more powerful, more attention should be paid to thermal management, which is essential to ensure stable LED performance and long lifetime. This is why OSRAM is devoting considerable attention to thermal design. T3Ster’s accuracy and repeatability enable us to verify our thermal designs and confirm the stability and reliability of our products,” stated Dr. Thomas Zahner, quality manager at Osram Opto Semiconductors. “By testing in bulk we get increased statistical confidence in the measurement results. The structure functions built into the T3Ster software are extremely powerful for identifying different thermal attach issues during our extensive reliability testing.”
“To design our lighting systems, we needed reliable data regarding LED characteristics and simulation tools which deliver results quickly. We found that Mentor’s T3Ster and FloTHERM products were the best such tools available to us and we could use them in our project to verify our PearLight street lighting luminaires for proper heat management. Accuracy and speed in achieving the results was critical for our business,” said András Szalai, CFO at HungaroLux.
FloTHERM allows engineers to implement virtual prototypes using advanced CFD techniques to simulate airflow, temperature and heat transfer in electronic systems. By using accurate thermal analysis, engineers can evaluate and test designs automatically before physical prototypes are built. When combined with the T3Ster product, engineers using the FloTHERM tool will benefit from both accurate thermal simulation models derived from real measurements and thermal package characterization testing.
“Mentor’s best-in-class thermal simulation and measurement of semiconductor packages and LEDs provide tremendous advantages for customers faced with thermal challenges,” said Erich Buergel, general manager of Mentor Graphics Mechanical Analysis Division. “The ease in creating accurate thermal models based on reliable thermal measurements helps users quickly to identify design problems and to create design alternatives which improve product quality, reliability, and increased profitability.”
www.mentor.com/mechanical
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