First merchant 800G silicon photonic datacentre chip
DustPhotonics in Israel is laying claim to the first merchant silicon photonics chip for 800G datacentre interconnect.
The 800G PIC (Photonic Integrated Circuit), shown at the European Conference on Optical Computing (ECOC) this week in Glasgow, is the first merchant single chip sampling for DR8 and DR8+ applications. It provides 8 optical channels independently modulated at 100Gb/s for an aggregate bandwidth of 800Gb/s.
The chip is designed into a compact 7.5mm x 7mm package, enabling it to be used in industry standard QSFP and OSFP style form factors and supports interconnect up to 2km in applications including hyperscale datacentre and AI and Machine-Learning clusters.
The PIC includes on-chip lasers, incorporating DustPhotonics’ patented L3C (low-loss laser coupling) technology, whereby off-the-shelf lasers from a variety of different manufacturers can be integrated with the PIC. This allows advantages in product performance, cost, power, and supply chain scalability.
- Fully integrated 2xFR4 photonic ASIC for 800G interconnect
- Scalable 200Gbit/s SiGe BiCMOS optical receiver
DustPhotonics is showing the chip in multiple configurations including a traditional 800GBASE-DR8 application, an immersion cooling application, and a reduced reach application. The immersion cooling demo showcases how this chip is suited to be immersed in a liquid coolant, since there is no free-space interface between the laser and PIC or at the fibre attach interface at the optical output of the chip.
For shorter reaches DustPhotonics is demonstrating a second, cost optimized version of the product suitable for transceivers or AOCs (Active Optical Cables) up to 100m, or for LPO (linear-drive pluggable optic) applications.
“We are seeing a lot of customer traction for this 800G application, and we are excited to showcase the broad range of applications that we support,” said Ronnen Lovinger, CEO of DustPhotonics. “We are well-positioned for the next phase of the company which is to scale into high-volume manufacturing.”
“We have been encouraged by the growth of the 800Gbit/s market, and we believe DustPhotonics single-chip PIC solution will help fuel adoption while easing some of the early supply chain constraints we are seeing in the industry,” said Vladimir Kozlov, Founder and CEO, LightCounting, an optical communications market research company.
The device is sampling to customers today and is expected to be in production by the first quarter of 2024.
Photonic technology developer OpenLight showed a DR8 photonic chip design in December for licensing to customers.
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