First Redcap chipset, for IoT, wearables

First Redcap chipset, for IoT, wearables

New Products |
By Nick Flaherty

MediaTek has launched the industry’s first 5G RedCap RF-SoC for lower bandwidth links across the Internet of Things (IoT) and wearables.

The T300 platform launched at Mobile World Congress this week is a 5G RedCap reduced capability RF-system-on-chip (SoC) built with MediaTek’s M60 modem. This supports the 3GPP Release-17 standard to offer significant generational advantages over existing 4G IoT solutions.

The T300 is based on a single ARM Cortex-A35 core running at 800MHz and has a simplified, reliable antenna design with integrated RF to extend battery life in 5G devices, while reducing development time and costs. The M60 modem reduces power consumption by up to 60% compared to LTE Cat-4 alternatives, and up to 70% compared to existing 5G eMMB solutions via the proprietary UltraSave 4.0 power management.

This enables device manufacturers to increase energy sustainability in large device deployments across the IIoT, mobile market, security, logistics, and IoT edge devices. The T300 supports 227 Mbit/s peak downlink speeds and 122 Mbit/s peak uplink speeds on a standalone 5G SA network.

The platform’s 3GPP Release-17 standard 5G modem supports a variety of energy efficiency enhancements including paging early indication, UE subgrouping, transmission range switch (TRS) while idle, PDCCH monitoring adaptation, and radio link monitoring (RLM) while active.

There is also 5G support for the transition to stand alone (SA) networks, along with support for LTE & NR-FR1 (20MHz) bands. Improved reliability comes with support for up to 256 QAM DL/UL, plus 1T2R MIMO / 1CC support for lower latency connections and the chipset supports dual SIM single active (DSSA) and network slicing, which is essential to support a variety of IoT applications.


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