First remote provisioning of iSIMs

First remote provisioning of iSIMs

Business news |
By Nick Flaherty

Giesecke+Devrient (G+D) and Sony Semiconductor Israel have developed the first commercial iSIM solution that supports remote SIM provisioning (RSP).

The integrated SIM (iSIM), the Universal Integrated Circuit Card (iUICC), is an important evolutionary step in SIM technology for simple and cost-efficient connection, deployment and go-to-market for Internet of Things (IoT) devices.

European hardware and software developers are leading the development and adoption of iSIM technology.

The iSIM-enabled ALT1350 chipset from Sony now supports standardized and future-proof RSP with G+D’s secure SIM operating system (OS). This is stored in a tamper-resistant element (TRE) within a system-on-a-chip (SoC), unlike insertable SIM cards or soldered eSIMs. It acts as an isolated hardware component that is combined with a baseband chipset to form a single connectivity module.

The iSIM has the potential to make IoT devices more flexible and efficient and is cost-optimized, smaller, more adaptable and sustainable than previous generations of SIMs.

GSMA iSIM standard

The RSP meets the new GSMA SGP.32 standard for M2M/IoT use cases to give IoT device operators flexibility in their choice of mobile network operators. This allows them to choose the optimal provider in terms of cost, service quality or network coverage, for example.

The capability to set profiles depending on the device’s location simplifies the global scaling of deployments. Additionally, RSP helps streamline production, storage, and logistics processes, to enhance operational efficiency.

Higher security is provided by the isolated hardware in combination with G+D’s secure and certified SIM OS. Production and warehousing processes can be optimized because there is no need to solder different hardware components or plug SIM cards into the device. iSIMs also support higher sustainability requirements, with the absence of slots, additional housings or plastic.

The low power consumption and small size means the iSIM is suited to battery-constrained IoT devices operating in low-power wide-area networks (LPWANs) through Narrowband IoT (NB-IoT) or LTE-M connections. Wearables are also among the potential areas of application. Typical use cases can be found in market segments such as smart metering, agtech, smart health, tracking and tracing or the entire spectrum of massive IoT.

G+D has a central SIM management system called AirOn360 for over-the-air administration of iSIMs and this supports both remote SIM provisioning of network operator-specific data and update management. This complies with GSMA RSP specifications for consumer, M2M and IoT applications and helps OEMs or device owners manage the iSIM lifecycle efficiently and securely. 

“As market leader in eSIM, G+D has been investing in the research and development of iSIM technology for a long time. Together with industry partners, we want to accelerate SIM innovation. A good example for this is our cooperation with Sony, under which we are now announcing the industry’s first commercial iSIM with remote SIM provisioning. This pioneering achievement empowers our customers to unlock the full potential of the IoT with flexible and cost-optimized connectivity. We are convinced that this will be another important milestone in the iSIM evolution,” explains Bernd Müller, Head of Technology and Strategy in the connectivity & IoT business at G+D.

“This solution marks another joint success between Sony and G+D. The iSIM is poised to reshape the future of IoT in which everything is connected,” added Dima Feldman, VP Product Management & Marketing at Sony Semiconductor Israel. “Our ALT1350 baseband chipset combined with G+D’s SIM operating system and management solution, has led to a powerful, simple, and secure IoT connectivity management system that will drive the market forward.”;

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