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First secure thermal simulation models for chiplet boost

First secure thermal simulation models for chiplet boost

Technology News |
By Nick Flaherty



Siemens Digital Industries Software is using Italian technology for the first high-fidelity thermal simulation models that can be shared in the electronic supply chain while protecting semiconductor OEM’s intellectual property.

Siemens’ Embeddable BCI-ROM technology provides secure reduced order 3D CFD thermal simulation models that maintain high accuracy for chiplets from multiple suppliers to be used in a single package.

Increasingly, modern IC package architectures such as 2.5D, 3D IC, or chiplet-based designs have highly complex thermal management challenges that require 3D thermal simulation both during their development and during integration of IC packages into electronics products.

In a high proportion of typical analysis processes, thermal engineers who are modeling packages in systems are struggling to secure suitably accurate 3D package thermal models within project time constraints. The ability to share data securely is a key challenge.

As a result designers may source a detailed thermal model from an OEM by request, they may take a simplified modeling approach, or they may create their own detailed thermal model or compact thermal model with only limited information they can source. This results in delays and often introduces inaccuracy from where there is a lack of accurate data. Inaccuracy leads to overdesign cost potential or under design reliability risks.  

The latest update to Simcenter Flotherm software for electronics cooling simulation includes the Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology that allows a semiconductor company to generate an accurate model that can be shared with their clients for use in down-stream high-fidelity 3D thermal analysis without exposing the IC’s internal physical structure.

The BCI part of an Embeddable BCI-ROM means that it can be used in any thermal environment which is advantageous when considering package thermal modeling for integration in different systems. A model is BCI if it predicts temperature in space and time with accuracy regardless of the thermal environment in which it is placed.  It will function correctly in natural convection, forced convection, with or without a heat sink, etc. 

The BCI-ROM technology is an extension of the FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC) method pioneered by Professor Lorenzo Codecasa from Politecnico di Milano, Italy. 

MediaTek isusing  Flotherm to drive efficiency in its collaboration with customers. “Embeddable BCI-ROM is a great way to share our thermal models with our customers. It has several key features: easy generation, confidentiality, low error rate, and suitability for steady-state and transient applications,” said Jimmy Lin, Technical Manager at MediaTek.

Electronic designs often have heat dissipation challenges that need to be resolved as a result of the higher power density from smaller semiconductor packages. This is driving the need for more detailed thermal models to help solve thermal management design tasks is growing.

“Given electronics supply chain pressures and the growing complexity of IC packages, barriers to collaboration and thermal analysis efficiency during design must be eliminated where possible to support competitive development,” said Jean-Claude Ercolanelli, Senior Vice President, Simulation and Test Solutions, Siemens Digital Industries Software. “Our breakthrough new technology enables accurate thermal models to be shared securely within the electronics supply chain without exposing sensitive intellectual property, allowing all parties to resolve thermal issues faster and bring advanced products to market more quickly.”

www.siemens.com

 

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