First single chip intelligent battery management for 20 cell systems
Qorvo has launched the industry’s first single chip intelligent battery management system (BMS) for 20 cell designs such as e-trikes, industrial equipment and battery backup.
The PAC22140 and PAC25140 Power Application Controller (PAC) devices are based on previous intelligent motor controller designs, integrating all the essential analog and power management peripherals with a 32bit ARM Cortex M0 or M4F microcontroller with a smaller board footprint
The BMS chips include cell balancing, monitoring and protection for 10s-20s battery packs using a programmable-gain differential amplifier, multiple 16-bit Sigma-Delta ADCs for current and voltage sensing, and a 10-bit SAR ADC.
A single-supply 145V-buck DC/DC controller generates a 5V system rail to power the device, while an integrated charge pump supports the charge and discharge FET drivers.
“The need for higher cell count solutions is increasing as end users demand longer battery life, faster charging time and lighter overall weight from new battery-powered applications,” said Brian McCarthy, senior manager for Qorvo’s PAC product line. “The highly integrated PAC22140 and PAC25140 provide designers complete solutions for these high-power, high-performance systems.”
|
Feature |
PAC22140 |
PAC25140 |
|
Microcontroller |
50-MHz Arm Cortex M0 with 10-bit SAR ADC |
150-MHz Arm Cortex M4F with 12-bit SAR ADC |
|
MCU memory |
32kB – Flash |
128kB – Flash |
|
Communication Supported |
UART, SPI, I2C/SMBus |
CAN, UART, SPI, I2C/SMBus |
|
GPIOs |
17 |
24 |
The PAC22140 and PAC25140 provide a low power hibernate mode of less than 3µA, enabling long storage time with wakeup from push button, timer or charger detection. The integrated high-voltage buck reduces thermal issues by supporting the system with a 5V regulated supply up to 225mA. An integrated 3.3V-LDO supplies up to 90mA for running additional peripherals. An analog MUX is connected to the SAR ADC for safety checks on internal nodes.
The PAC22140, in volume production today, is available in a 9×9 mm, 60-pin QFN package, while the PAC25140, sampling today with production in April 2023, is available in a 10×10 mm, 68-pin QFN package.
Qorvo’s PAC22140EVK1 and PAC25140EVK1 hardware development kits enable users to develop intelligent BMS solutions by taking advantage of the fully integrated ARM Cortex-M microcontroller with a BMS-specific analog front-end (AFE).
These products will be highlighted at Embedded World 2023 (EW2023) next week.
www.qorvo.com/newsroom/trade-shows/ew-2023.
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