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First single chip MEMS ultrasonic transducer

First single chip MEMS ultrasonic transducer

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By Nick Flaherty



Infineon Technologies has developed what it says is the first single chip capacitive MEMS ultrasonic transducer for embedded switches and medical sensors.

The size reduction of the capacitive micromechanical ultrasonic transducers (CMUT) opens up new ultrasonic applications in consumer electronics, the automotive industry, and medical technology as well as improving existing applications using larger piezoelectric transducers. There are several projects developing the technology in sensor makers and startups. 

 The CMUT transmits and detects ultrasonic waves via the deflection of a micro-machined, semiconductor diaphragm. This enables solid-state touch buttons under any solid material, such as glass and even metal, without deforming the surface. 

This allows a more durable and reliable alternative to conventional mechanical buttons with less wear and tear and a longer overall lifespan of devices. Compared to capacitive touch buttons, which can be affected by environmental factors such as humidity and temperature, CMUT-based touch buttons offer full water compatibility as well as high EMC robustness.

The technology reduces the size of the buttons so they can be integrated into various devices, from smartphones to industrial control panels. Examples include touch buttons below the metal frame of a mobile phone or replacing car door handles for a neat design.

Using a micromechanical MEMS process allows the processing to be integrated alongside the transducer to reduce the size and the noise floor. The monolithic integration of MEMS and ASIC reduces the noise floor by 20 times and improve the absolute signal by 1000 times compared to conventional piezoelectric ceramics of a similar size, simplifying the design of the rest of the system.

The CMUT technology can also be used to develop innovative medical devices that utilize ultrasound technology, such as wearable devices for vital signs monitoring, health tracking, and non-invasive medical diagnostics. Leveraging CMUT technology, the devices provide continuous monitoring and feedback rather than a single measurement, which can detect potential health issues earlier and improve patient outcome. With their compact size and low-power requirements, they are ideal for wearable and point-of-care applications.

Packaging is also key, and Infineon uses an embedded wafer level ball grid array (eWLB) package with ST Microelectronics and STATS ChipPac that uses a silicon substrate to fan out the connections for easier assembly on flexible substrates.  

The CMUT ultrasonic transducer can also be used for level sensing, including continuous fill level measurement with non-invasive mounting below the bottom of the tank. The latter is important to measure, e.g., chemicals in washing machines or dishwashers, where contact electrodes are at risk to corrode.

“Our ultrasonic technology can achieve a very high signal-to-noise ratio and offers a high level of integration. That’s why we believe that the devices represent a breakthrough in the industry,” says Emanuele Bodini, Senior Director at Infineon. “We want to leverage the technology to develop a product platform that is capable of serving multiple use-cases through different industries.”

www.infineon.com/

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