TE Connectivity (TE) has developed a device that provides a controlled and reliable solder joint for low outgassing applications, including low earth orbit (LEO) satellites.
The SolderSleeve is designed to meet the demands of the space industry, which require minimal to zero foreign object damage (FOD) in applications. It uses heat shrinkable technology that allows it to connect, insulate and protect in one step. The solution is made with a transparent insulation sleeve, rated up to 150 degrees Celsius, and has a tensile strength of up to 15lb.
This supports splicing wires and shield terminations in small, nano and cube satellites for LEO constellations and launch pads, while helping to ensure end-to-end quality control starting with the material through in-house production, testing and the final product.
“TE’s SolderSleeve interconnection device for space offers an ideal solution for high reliability, reduced SWaP and environmentally protected shield termination on cables that help insulate, protect and provide strain relief at the same time,” said Ujjwal Varma, product manager for TE’s Aerospace, Defense and Marine division. “Our inhouse design and quality-controlled process offers complete reliability and traceability for our products.”
The product requires minimal tools for installation, and is tested and qualified for low outgassing parameters, which are in line with TE specification 108-160024, ASTM E-595 (ECSS-Q-ST-70-02C) and RT-1404.
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