First ST/Qualcomm Bluetooth/Wi-Fi module enters mass production
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STMicroelectronics has announced the start of mass production of its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, developed in collaboration with Qualcomm Technologies. Furthermore, Siana Systems is a lead customer for this fast-to-market connectivity module.
The Bluetooth/Wi-Fi module is the first product resulting from the collaboration between ST and Qualcomm Technologies, announced in 2024, to simplify the implementation of wireless connectivity in systems containing STM32 microcontrollers (MCUs).
The ST67W module can be integrated with any STM32 MCU and contains a Qualcomm Technologies multiprotocol network coprocessor and 2.4 GHz radio. All RF front-end circuitry is built-in, including power and low-noise amplifiers, the RF switch, balun, and an integrated PCB antenna. Furthermore, the module features a 4 MB Flash for code and data storage, as well as a 4 MHz crystal. It comes pre-loaded with Wi-Fi 6 and Bluetooth 5.4 and is pre-certified according to mandatory specifications. Thread and Matter will be supported soon via software updates. There is also an optional coaxial antenna or board-level connections for an external antenna.
Security is handled with cryptographic accelerators and services, including secure boot and secure debug, which adhere to PSA Certified Level 1 certification. This makes it easy for customers to comply with the upcoming Cyber Resilience Act and RED directives.
“Wireless connectivity is a key enabler for the cloud-connected intelligent edge, and demand for smart, connected devices continues to expand and accelerate throughout consumer and industrial markets,” said Jerome Vanthournout, Connectivity Business Line Director, STMicroelectronics. “Mastering the complex Wi-Fi and Bluetooth protocols and bringing that connectivity to devices and IoT applications are huge challenges. Our modular solution, created with industry-leading know-how, lets product developers focus their resources at the application level and bring new products to market quickly.”
Shishir Gupta, Senior Director of Product Management at Qualcomm Technologies, added, “This module, which contains Qualcomm Technologies’ wireless connectivity components, not only simplifies the integration of Wi-Fi and Bluetooth into a wide range of devices powered by STM32 microcontrollers but also offers incredible flexibility and scalability.”
Product developers need no RF design expertise to create a working system using this module. Highly integrated in a 32-lead LGA package, it is ready to place on the board and permits simple, low-cost PCB designs with as few as two layers.
Siana Systems is among the first IoT technology companies to explore the opportunities this wireless connectivity module brings to enhance product performance and accelerate time to market.
“The ST67W module expands opportunities to add Wi-Fi to devices powered by various STM32 microcontrollers. We can simply integrate the module and quickly get Bluetooth and Wi-Fi connectivity, with minimal additional engineering, which provides us with a simple go-to solution for our next-generation designs,” said Sylvain Bernard, Founder and Solution Architect, Siana Systems. “The module’s RF performance, with the radio and front-end circuitry integrated, is very strong, and the flexible power management with fast wake-up times lets us create extremely energy-efficient new products.”
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