First top-side cooled surface mount power packaging
Thermal management of today’s switch mode power supply designs still remains a barrier to efficiency. The Double DPAK (DDPAK) is aimed at high power applications such as server, telecom, solar and high-end PC power using the latest silicon MOSFET or silicon carbide technologies. The new packaging enables faster switching and higher efficiency in reduced size and weight with a lower total cost of ownership.
DDPAK offers a key SMD alternative for high power SMPS designs as the four-pin configuration allows for separate pin source-sense to deliver undisturbed signal to the driver, allowing higher efficiency at full load.
The top-side cooled package is combined with Infineon’s existing high voltage technologies of 600V CoolMOS G7 SJ MOSFET and CoolSiC Schottky Diode 650V G6. The thermal decoupling of the printed circuit board and semiconductor (see below) enables higher power density or longer system lifetime and can be combined with the EiceDRIVER families.
600V CoolMOS G7 SJ MOSFET and CoolSiC Schottky Diode 650V G6 with DDPAK packaging are available now.
www.infineon.com/smd-topsidecooling.
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