Flat acoustic module targets tablet computer sleeves
The modular format embraces a range of HiWave’s intellectual property developed to create compelling audio quality and volume from small, flat surfaces. This includes the design of low-profile electromagnetic exciters, the algorithms to determine optimum positioning on any panel, the specification of the material for the ultra-light panel, and its suspension dynamics in the protective shell. The protective shell enables tablet computer sleeve developers to easily incorporate the module into soft or hard enclosures and keeps the profile slim.
Designers can incorporate amplifier and interface electronics into the module by positioning a printed circuit board and battery pack into the cavity provided in the shell. For high-end applications, HiWave is working on the development of its Audium amplifier chip and a reference design. This will optimise audio quality using the on-chip audio processing core to equalise (EQ) the signal to take into account the materials and assembly of any SoundSleeve design. The Audium chip’s signal processing capability can also be used to further enhance low-frequency performance and widen the stereo effect from a small format tablet sleeve. The tablet becomes a ‘personal cinema’.
Visit HiWave Technologies at www.hi-wave.com
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