Flex FPGA ported to GloFo’s FDSOI process
Flex has announced that both logic and DSP tiles are in design for the 22FDX fully-depleted silicon-on-insulator process.
“We have seen substantial interest in 22FDX due to its special capabilities for fast, low-power integrated circuits especially for aerospace and communications,” said Geoff Tate, CEO and cofounder of Flex Logix, in a statement. “The EFLX 4K Logic and DSP cores are now in design on Globalfoundries 22FDX and will provide flexibility and acceleration for these customers’ integrated circuits while boosting performance and cutting cost compared to using a standard external FPGA. Customers are already in the design and development phase of SoCs that will use the EFLX 4K for 22FDX.”
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