
Flex, onsemi team for compact Intermediate Bus Converter
Flex Power Modules has teamed up with onsemi to develop a compact Intermediate Bus Converter (IBC) in an LGA footprint for data centre power.
The non-isolated and unregulated BMR313 IBC measures 23.4 x 17.8 x 7.65 mm, yielding a power density of 908 W/cm3 power density and an efficiency of 97.3% efficiency with a 54 V input. The peak power is 3kW, with a continuous power output of 1kW from an input voltage range of 40 – 60 V. The 4:1 input to output ration yields an output of 10 – 15 V, and the part is thermally optimized for cold wall mounting on the top side. The BMR313 is offered in the industry-standard LGA footprint and pin-out.
The IBC uses onsemi’s FD6000 latest intermediate bus digital controller with integrated PMBus telemetry. The FD6000 is based on a resonant DC Transformer (DCX) topology, operating at higher than 1 MHz to provide the small size while maintaining the high efficiency for data centre operation.
The onsemi controller is also flexible and can be used for future variants of the IBC range with higher and lower input to output conversion ratios.
- Flex joins Xilinx power programme to support FPGA designs
- Flex moves to 48V direct conversion for data centre and cloud
- Flex, Infineon team for 48V switched capacitor IBC
“Our collaboration with onsemi in the development of the BMR313 has enabled us to achieve remarkable power density for demanding, space-constrained applications,” said Mikael Appelberg, CTO of Flex Power Modules. “onsemi provided excellent support, customizing firmware to our specific requirements.”
“We are extremely pleased with the level of innovation in energy efficiency and density achieved by combining Flex Power Modules’ and onsemi’s technical talent and technological capabilities,” says Roberto Guerrero, general manager of the Cloud Power Solutions business unit at onsemi. “Flex Power Modules BMR313 and onsemi’s FD6000 are setting a new standard in powering the cloud.”
The BMR313 IBC will be launched at the 2022 Open Compute Project global summit in San Jose next week.
Other articles on eeNews Power
- 10U SOSA chassis supports redundant rear pluggable power supplies
- Tight supply drives up power device sales
- Amber Semi plans AC direct drive chip for microcontrollers
