Flexible electronics scale up to billions with fab-in-a-box

Technology News |
By Julien Happich

The first FlexLogIC system to be commissioned from Deutch contract manufacturing partner VDL Enabling Technologies Group (VDL ETG) and expected in 2017, will transfer PragmatIC’s proven end-to-end flexIC production process into a self-contained, fully automated, modular design, with capacity for billions of flexICs at a capital cost between 100 and 1000 times lower than a silicon fab.

NB: analysis assumes footprint is limited by complexity not I/O pads (more pads would increase inflection & crossover point) – (source PragmatIC)

“The initial system will be focused primarily on scale-up of production based on our current design rules, however the architecture is easily adapted with only minor changes for future nodes. Throughput is in the billion of flexICs per annum (depending on functionality etc). The system includes fully automated software control. We are also developing IP libraries including reference product designs based on our existing standard cell libraries, but would expect to leverage our partner relationships to ensure a complete ecosystem (e.g. ARM)”, told us PragmatIC’s Chief Executive Officer, Scott White.

Although the first system will be used in-house by PragmatIC to scale up production for its existing customers, the company expects that as certain products reach maturity and mass-market volumes, its business model could evolve to include sales of FlexLogIC systems (along with a technology licence) to customers/partners for their own in-line production.

The CEO pointed that already five customers had showed their interest in buying a FlexLogIC system for their own production purposes.

Visit PragmatIC Printing Ltd at

Visit VDL Enabling Technologies Group at


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