Flexible PCBs can be populated automatically
At the Productronica trade fair for electronics production in Munich from 14 to 17 November 2017, Fraunhofer IPT will be presenting a combined process of roll-to-roll printing and automated foil assembly, which can be used to produce large numbers of flexible electronic components.
By combining printed films with more complex semiconductor elements, it is possible to integrate a wide range of functions in addition to electrical signals. However, the manufacture of such combined assemblies presents a number of challenges, such as the assembly of systems, especially when optical functions are required. The Fraunhofer IPT is therefore not only researching the roll-to-roll process for the continuous production of flexible, hybrid circuit carriers and developing manufacturing modules for existing production plants. The Aachen researchers also combine this technology with a basic machine for automated assembly and connection technology for opto-electronic systems such as lasers or cameras. By combining these two manufacturing approaches into a complete solution, it is possible to manufacture printed electronics continuously and to equip them with electronic components in the next step.
For the continuous production of multifunctional films, the Fraunhofer IPT has been relying on a roll-to-roll line developed in-house for several years, which can be operated with different modules. The line can be used to produce low-cost films with integrated fluidic, optical or electronic functions. An inkjet module makes it possible to apply the printed electronics onto foil. A further module connects the functionalized layers to a multi-layer film system. The modular design guarantees a free combination of the different modules to quickly and customer-oriented build up and retrofit individual plants.
The combination of printed electronics and optical structures as well as biofunctional surfaces and microfluidics enables completely new markets to be served. For example, complete lab-on-a-chip systems can be produced cost-effectively in large quantities.
The placement of SMD components on the multifunctional films is intended to expand the application possibilities of roll-to-roll production. However, as circuit carriers, the films make special demands on the assembly process, such as flexibility and continuous movement of the film substrate. Here, the Fraunhofer IPT is planning to integrate conventional placement systems into the continuously running roll-to-roll production line in order to position and assemble the electronic components without changing the conveying speed of the film. Instead of the conventional placement modules, a micro assembly cell developed by Fraunhofer IPT can also be integrated into the process.
More Information: www.ipt.fraunhofer.de
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