Flip chip in 2.5W DC-DC converter enables QFN package
Recom has usd flip chip technology to fit a 2.5W DC-DC converter into a low profile QFN package.
The RPX-2.5 module has a high power density footprint on a 4.5mm x 4mm x 2mm thermally-enhanced QFN package to increase the power density and improve the thermal management.
The DC-DC converter family has an input range from 4.5 to 28VDC, allowing 5V, 12V or 24V supply voltages to be used. The output voltage can be set with two resistors in the range from 1.2V up to 6V. The maximum output current is 2.5A, and the output is fully protected against continuous short-circuits, output overcurrent, or over-temperature faults. It has an efficiency of up to 92%, and it is thermally optimized due to its flip-chip technology. An integrated shielded inductor in this miniature package makes it optimal for space-constrained applications.
To facilitate rapid testing, Recom has also developed an evaluation board for this product so that customers will be able to quickly and easily test. Converter samples, evaluation boards, and OEM pricing are available from all authorized distributors or directly from the company.
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