Flip-chip packaged LEDs offer backlighting cost savings
New Products
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By
eeNews Europe
The X-CHIP 2016, which features an ultra-thin outline design, provides a wide emitting angle, faster heat dissipation, compact size and high lumen efficacy with a maximum lumen output capable of reaching 210 lm. The device shortens the production process, increasing the yield, whilst also enhancing reliability and prolonging the operation lifetime. The device’s main color gamut range is 0.275±0.025 / 0.245±0.015.
The X-CHIP 2016, which fits in a 2.0 mm × 1.6 mm × 0.8 mm flip-chip package, is designed for various backlight applications, especially TV backlighting, tablet panel backlighting and flashlight of cell phones and such like.
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