Flip chip technology for power boosts thermal performance in car designs

Flip chip technology for power boosts thermal performance in car designs

New Products |
By Nick Flaherty

In flip chip technology, the chips are mounted upside down in the package. Since the heated part of the IC thus faces the underside of the package and is closer to the circuit board, the thermal inductance can be improved two to three times. The significantly higher power density enables a significantly smaller footprint than conventional package technologies.

The footprint of Infineon’s flip chip linear voltage regulator (TSNP-7-8 package, 2.0 mm x 2.0 mm) is more than 60 percent smaller than that of an established reference product (TSON-10 package, 3.3 mm x 3.3 mm) – with the same thermal resistance. This makes the device particularly suitable for applications with very limited space on the PCB, such as radar and camera systems. The OPTIREG TLS715B0NAV50 delivers 5 V with a maximum output current of 150 mA.

Flip chip has been used for several years, especially in consumer and industrial markets. Due to the ever decreasing space available, especially in the growing number of radar and camera systems, the demand for ever smaller power supply solutions is also increasing in automotive electronics. However, the quality requirements here are significantly higher. In order to achieve flip-chip quality superior to that of its competitors, Infineon does not rely on post-qualification of existing consumer and industrial products, but rather on its own production for automotive products.

In the future, Infineon will further strengthen its entire portfolio of automotive power supply products of the OPTIREG family with flip chip technology. The chip manufacturer also plans to use the technology in its switching regulators and power management ICs.

More information: OPTIREG TLS715B0NAV50

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