Form-in-place gasket handbook offers design guidance for enclosure design engineers
CHOFORM silicone-based materials meanwhile incorporate a conductive filler to combine EMI shielding with an environmental seal. The provision of enclosure sealing, either with or without shielding capability, is a growing challenge for engineers developing a wide range of electronics equipment as they seek to ensure reliable performance in what are often very challenging operating conditions.
The comprehensive new CHOFORM and ParPHorm European handbook provides detailed information to help design engineers develop and implement the optimum sealing and shielding solutions. In addition to detailed specifications for the, environmental, mechanical and shielding performance of the complete range of FIP materials, the new handbook also gives comprehensive and valuable design guidance. This includes information on how to optimise the housing design onto which the FIP material will be applied in order to maximise quality and production efficiency, and design considerations relating to gasket bead profiles and material application.
CHOFORM and ParPHORM FIP technology allows the precise dispensing of conformable gaskets onto equipment housings. Small enclosure compartment cross sections enabled by employing dispensed FIP materials can free valuable package space, this can help designers realise smaller form factor products with greater included functionality. FIP gaskets are also extremely cost-effective giving a very low total cost of ownership.
The dispensed pattern of Chomerics’ FIP gasket materials is primarily software driven. This allows for fast and easy prototyping as well as the easy, low cost accommodation of changes in bead profile necessary when the housing design is changed.
Visit Chomerics at www.parker.com/chomerics
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