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Form-in-place thermal gap filler has a thermal conductivity of 4.0 W/m-K

Form-in-place thermal gap filler has a thermal conductivity of 4.0 W/m-K

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By eeNews Europe



The two-part liquid material has shear thinning characteristics for optimum dispensing, and displays excellent wetting with ultra-conformability to minimise stress on components during assembly. Designed for filling unique and intricate air voids and gaps, the gap filler remains in place after dispensing and maintains its shape on the target surface. It has a low level of natural tack, and is intended for applications where a strong structural bond is not required. Cure time is 24 hours at room temperature or 30 minutes at 100°C.

 

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