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Foxconn, HCL team up on Indian chip packaging

Foxconn, HCL team up on Indian chip packaging

Business news |
By Peter Clarke



Taiwan’s Foxconn is forming a joint venture with Indian IT conglomerate HCL Technologies to form a chip packaging and testing factory in India, according to reports.

Various reports referenced a regulatory filing by Hon Hai Precision Industries in Taiwan, which trades as Foxconn. The filing reportedly states that Foxconn will take a 40 percent stake in the unnamed joint venture with a US$37.2 million investment.

“Through this investment, the partners aim to build an ecosystem and foster supply chain resilience for the domestic industry,” Foxconn is quoted saying in a statement. The location and timetable for establishing the facility was not given.

Reportedly the packaging and test facility will require an initial investment of up US$150 million, excluding government incentives. The joint-venture is in discussions with the states of Tamil Nadu and Telangana, according to one report referencing unnamed executives. The venture is said to have also looked at Karnataka but favors Tamil Narda or Telangana because of higher levels of subsidy available there.

In focusing on package and test Foxconn will be following in the footsteps of Micron Technology Inc. (Micron breaks ground on US$2.75 billion Indian chip packaging fab) and others in India (see Tata commits to semiconductor factory in Gujurat, India).

However, Foxconn is also looking to set up a wafer fab in India, where the government has offered US$10 billion in incentives to start local IC and display manufacturing. Foxconn was in a consortium to set up a wafer fab with Indian company Vedanta.  Foxconn pulled out of the consortium in the middle of 2023 (see Foxconn pulls out of Indian wafer fab venture).

Related links and articles:

www.foxconn.com

News articles:

Foxconn selects Porotech for microLED displays

Foxconn pulls out of Indian wafer fab venture

Tata commits to semiconductor factory in Gujurat, India  

India’s Vedanta-Foxconn appoints GloFo alumnus as chip advisor

Micron breaks ground on US$2.75 billion Indian chip packaging fab

Report: Foxconn, TSMC in talks over Indian wafer fab

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