Fraunhofer, EV team for 300mm 3D quantum chip

Fraunhofer, EV team for 300mm 3D quantum chip

Business news |
By Nick Flaherty

The EV Group (EVG) is teaming up with the Fraunhofer IZM-ASSID All Silicon System Integration division to develop and optimize alternative bonding and debonding technologies for 300mm CMOS and heterogeneous integration applications, including quantum computing.

Fraunhofer IZM-ASSID is installing an EVG 850 DB fully automated UV laser debonding and cleaning system at its Centre for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany.

This marks the start of Fraunhofer’s Bond-Hub, which will additionally comprise a multitude of leading-edge temporary as well as permanent wafer-to-wafer and die-to-wafer bonding systems.

CEASAX combines core competencies from Fraunhofer IZM-ASSID and the Fraunhofer Institute for Photonic Microsystems (IPMS) to further research into 300-mm, 3D heterogeneous wafer-level system integration and front-end semiconductor integration processes for high-performance neuromorphic computing, cryo- and quantum technology.

Layer transfer tech comes to high volume chiplet, 2nm manufacturing

The EVG850 DB is the first system to be installed at CEASAX, and will help enable Fraunhofer IZM-ASSID to close critical process gaps and offer technology modules for the manufacturing of quantum systems and their wafer-scale hardware environment based on a 300mm cleanroom environment.

The EVG850 DB fully automated UV laser debonding and cleaning system enables high-throughput, low-cost-of-ownership room-temperature debonding for ultra-thin and stacked fan-out packages. It incorporates a solid-state UV laser and proprietary beam-shaping optics to enable optimized, force-free carrier lift-off. For more information on the EVG850 DB UV laser debonding and cleaning system.

Temporary wafer bonding is a widely used method to ensure the processing of thin wafers (under 100-micron silicon thickness), which are important for 3D ICs, power devices and fan-out wafer-level packaging (FOWLP), as well as for handling fragile substrates like compound semiconductors.

The debonding of the carrier wafer is an essential step to prepare the device wafer for the final process steps toward singulation and integration of the dies into the end device or application. Fraunhofer can perform these debonding processes entirely in house with the EVG850 DB, enabling significantly shorter development times for optimal process flows with various bonding adhesive systems. This in turn will allow Fraunhofer totailor its processes to the specific needs of its many customers.

EVG, Toppan team for nanoimprint photonics lithography

“Fraunhofer and EV Group have enjoyed a long and successful collaboration in developing new processes that have helped enable critical, emerging micro-electronics applications – including multi-device integration of analog and digital devices such as ASICs, RF devices, sensors and transceivers into an optimized system-in-package or functional smart microelectronic systems,” said Manuela Junghähnel, site manager at Fraunhofer IZM-ASSID.

“We are excited to be expanding and reinforcing this partnership through the purchase of the EVG850 DB laser debonding and cleaning system, which will be the first of several key product installations at CEASAX. Through this expanded relationship, Fraunhofer will receive state-of-the-art technology in-house and have a strong partner in EV Group for developing new technologies for 3D device integration, which in turn will offer our customers a more complete process chain for 3D/heterogeneous integration from a single source.”

“Our expanded collaboration allows EVG to stay at the forefront of technology advancements and enable us to contribute to the development of new manufacturing processes for quantum systems,” said Markus Wimplinger, corporate technology development and IP director at EVG.

EVG’s wafer bonding, lithography and metrology solutions enable the development and high-volume manufacturing of technology innovations in advanced packaging—including backside illuminated CMOS image sensors and other 3D-IC stacked devices—as well as in MEMS and compound semiconductors.

Recent breakthroughs in hybrid bonding to address the needs for 3D device integration, wafer bond alignment technology to address future 3D-IC packaging requirements, IR laser release technology to eliminate glass substrates for advanced packaging and enable thin-layer 3D stacking, maskless exposure for fan-out wafer level packaging (FOWLP), and NIL and resist processing to support wafer-level optics (WLO) manufacturing.

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