Freeform packaging technology flexibly encapsulates semiconductor sensors or MEMS
nCapsulate uses transfer molding with a thermosetting compound that delivers better isotropy and thermomechanical stability than the thermoplastics of standard injection molding technologies. It combines this with special mold tools developed by Sencio and a toolshop partner. Together, these developments enable device encapsulation that delivers the same excellent protection as traditional packages but that can be formed into any shape required. For example, manufacturers can use nCapsulate to add mounting, alignment and support features to a standard package design, or embed sensors or MEMS directly into plastic components such as tubes and system casings.
According to Jurgen Raben, manager technology, research & innovation of Sencio BV, nCapsulate’s freeform nature helps manufacturers streamline or even eliminate post-encapsulation assembly steps to improve production efficiency and save money. Customers can combine nCapsulate with Sencio’s other functional packaging capabilities, such as the ability to expose sensor surfaces while protecting delicate integrated circuits, to create a functional packaging solution tailored to their precise needs. nCapsulate can be applied to leadframe based packaging as well as other substrates such as PCBs or ceramics.
Visit Sencio at www.sencio.nl
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