Gen3, Zestron team for board test
Gen3 Systems is working with Zestron in the US on a new test service for the US electronics industry based around the latest release of IPC-J-STD-001 Revision H.
Zestron, based in Manassas, Virginia, operates eight technical centres around the world. It is using AutoSIR, AutoCAF and CM Series PICT test instruments from GEN3, which helped to set up the service.
IPC-J-STD-001 Revision H covers the requirements for Soldered Electrical and Electronic Assemblies and is recognized as the sole industry-consensus standard for soldering processes and materials. Alongside the IPC-A-610H on the acceptability of electronic assemblies for post-assembly acceptance. The two standards are used to ensure electronic assemblies meet acceptance requirements for the electronics industry.
J-STD-001H includes new Cleaning and Residue Requirements as well as guidance on using X-ray analysis for Acceptance for Solder Connection. It covers Electro-Chemical Migration (ECM) as a fast-developing issue with electronic circuit assemblies, especially as higher density packaging and circuit miniaturisation continues to evolve.
Measuring changes in surface insulation resistance (SIR) is neither fast nor straightforward. However, users will have access to data to ascertain when and at which point in their assembly process, ECM problems appear. This will help evaluation of the material set, so vital in determining electro-chemical compatibility between each assembly step.
“It is always an issue trying to demonstrate SIR measurement and process control equipment especially during the ongoing Covid-19 restrictions. Having our equipment available in such a well-suited facility, means that customers can more easily and better evaluate their requirements in achieving the desired Objective Evidence,” said Graham Naisbitt, presient of family-owned Gen3 Systems in Farnborough, Hampshire.
The Zestron set-up permits testing pre-prepared IPC B52 test coupons, or a B53 coupon for material pre-screening.
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