GF adds 40nm CMOS, 130nm BCD processes for automotive
GlobalFoundries (GF) has added two process technologies for automotive chip designers.
The 40ESF3 technology is a 40nm CMOS process for analog and power designs and will be part of GF’s existing AutoPro platform, which provides automotive chip designers a broad set of technology and manufacturing services that minimize certification efforts and speed time-to-market.
With a junction temperature of 175°C, the technology is suited to manage the critical functions of a vehicle under temperature extremes. GF has not made public what embedded memory technologies will be supported in the 40ESF3 process, although AutoPro platform does include automotive qualified flash at 40nm.
“By leveraging this 40nm technology on GF’s AutoPro platform, Bosch will continue to build cutting-edge solutions that address the growing needs of the automotive industry for software-defined vehicles that rely on complex electronics systems that are controllable and reliable,” said Jens Fabrowsky, Executive Vice President Automotive Electronics at Robert Bosch.
GF is also adding a 130BCDLite Gen2 ATV125 process to its BCD/BCDLite platforms for power management. The technology will enable multiple automotive applications, allowing for die shrink and higher conversion efficiency for products requiring up to 40V, while also meeting the rigorous Auto Grade 1 qualification—a standard indicating the component’s reliability in extreme automotive temperatures.
Over 30 customers are currently engaged on the 130BCD/BCDLite platforms, enabling them to efficiently develop products with cost-effective integration of diverse functionality with power devices across a wide range of voltages.
“As a highly innovative company, Inova Semiconductors is expecting the same from its suppliers as we continue to provide to our global automotive customers reliable, high-quality chips enabling easier, faster, and more reliable communication inside the vehicle. We are pleased to collaborate with GlobalFoundries on new technologies that meet and exceed the demands of the industry,” said Robert Kraus, CEO at Inova Semiconductors.
“The shift from internal combustion engines (ICE) to autonomous, connected, and electrified (ACE) requires vehicle re-architecture. GF is perfectly positioned for this shift, and our recent technology advances support increased safety, enhanced user experience, and sustainability through vehicle electrification,” said Mike Hogan, Chief Business Unit Officer at GF
Both technologies are planned to be fully qualified and released into production by September 2023, with a robust automotive-ready quality system to continually improve quality and reliability throughout the product life cycle.
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