Glass interposer for next generation chiplet packaging
An interposer is a high-performance intermediate device that electrically connects multiple chips and substrates and the technology is expected to play a key role in next-generation semiconductor packaging.
The company has been part of the Jisso Open Innovation of Tops 2 (JOINT2) consortium with 11 other companies developing technologies for mass-production in 2024. The consortium is managed by Showa Denko Materials.
The interposer, which measures 40 x 40mm, overcomes the issue of an increase in wiring resistance, and degradation of insulation resistance between the wirings, to achieve the high-performance necessary for leading edge semiconductor packaging.
Related articles
- Samsung improves interposer-based packaging
- Samsung teams for next gen chiplet packaging
- Interposer embeds capacitor to shrink package size
- Industrial radar sensor is built in glass
DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by employing microfabrication technology based on printing processes.
“Through cooperation with the other participating JOINT2 companies, DNP will accelerate the further functionality of the interposer as well as advance initiatives aimed at mass production in 2024. We will also promote the development of next-generation semiconductor packaging technology,” said Ryoichi Ohigashi of the Research and Business Development Center, DNP.
Other articles on eeNews Europe
- Intel teams with Leti to advance 3D packaging
- Stellantis to build its semiconductors together with Foxconn
- Fraunhofer extends RISC-V embedded processor for edge AI
- Europe shows 2nm, quantum technologies at IEDM
- US sues Nvidia over ARM deal
- €100m project to develop low power edge AI microcontroller
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
