Glass substrate factory for chiplet packaging coming to Georgia

Glass substrate factory for chiplet packaging coming to Georgia

Business news |
By Peter Clarke

The company will invest more than $473 million, according to the state of Georgia, although in announcements out of Korea the investment amount was put at $80 million. SKC said the rest of the investments will come from its partner companies. The investment is expected to create more than 400 jobs.

“Our new technology will be key in enabling utmost performance with minimal power consumptions for high-performance computing, as well as for high-speed communication applications, and this technology is scalable for many other technology needs. Georgia will be a basecamp for SKC’s AI and high-speed data center semiconductor applications,” said Sung Jin Kim, SKC director of new business development, in a statement from Georgia state.

SKC is proposing the use of its glass substrates as an interposer for chiplet style packaging.

Sung Jin Kim helped develop this glass substrate technology through research conducted at Georgia Tech Packaging Research Center while he was a research professor in the Electrical and Computer Engineering department at the Georgia Institute of Technology from 2012 to 2015.

SKC plans to build a 12,000-square-meter production plant with plans to expand it into a 72,000-square-meter production plant by 2025.

The use of glass substrates can allow package thickness to be halved along with power consumption. By the same token data center footprint can be significantly reduced as data throughput is dramatically improved. The prototype has qualified by a global semiconductor manufacturer, SKC said but did not name them.

SKC has proposed a glass substrate with a smooth surface to dispense with the use of a silicon interposer.

“SKC’s glass substrates are receiving great attention from global semiconductor material suppliers and semiconductor manufacturers alike as they are produced with the ground-breaking technology that enables chip designers to achieve the maximum performance they can ever aspire to,” said an unnamed SKC official. “We will build a stable business base in collaboration with our business partners so we supply our innovative products to global semiconductor manufacturers while contributing to innovations across the industry using high-performance semiconductors.”

Related links and articles:

News articles:

Samsung announces H-Cube 2.5D packaging

Interposer embeds capacitor to shrink package size

Applied talks technologies, collaborations to aid chiplet assembly

Industrial radar sensor is built in glass

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