Global chip capex to rise 11% in 2014
Worldwide semiconductor capital spending is going to total $64.5 billion in 2014, an increase of 11.4 percent from 2013 spending of $57.8 billion, according to market forecaster Gartner.
Gartner breaks the semiconductor capex down into seven categories: capital spending; wafer fab equipment; other wafer-level manufacturing equipment; wafer-level packaging and assembly equipment; die-level packaging and assembly equipment and automated test equipment.
Capital equipment spending will increase 17.1 percent in 2014, driven by strong memory average selling prices and increased demand for consumer products (see table).
Worldwide semiconductor manufacturing equipment spending forecast, for 2013 to 2018 (Millions of dollars). Source: Garnter. To see larger form of chart click here.
For 2014, Gartner’s forecast for semiconductor equipment has been increased slightly from the previous forecast. Longer term, Gartner expects modest growth through the semiconductor cycle, with just a modest pause in the equipment market expected in 2016.
Gartner said that whereas in previous years spending had gone into buildings in 2014 the growth would be in equipment as manufacturers concentrate on ramping capacity.
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