Globalfoundries, Amkor partner for European OSAT

Globalfoundries, Amkor partner for European OSAT

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By Peter Clarke

US packaging firm Amkor Technologies Inc. (Tempe, Ariz.) has formed a European partnership with GlobalFoundries Inc.

Under the arrangement foundry chipmaker Globalfoundries will transfer bump and sort lines for 300mm wafers from its Dresden wafer fab to Amkor’s facility in Porto, Portugal. GF will maintain ownership of the transferred tools, processes and IP in Porto.

The move will create a comprehensive EU supply chain for GF from semiconductor wafer production through to Outsourced Semiconductor Assembly and Test (OSAT). It will also open up additional clean room space in Dresden.

At Porto Amkor already works with Infineon Technology and STMicroelectronics to package chips for such automotive applications as electrification, body electronics, and connectivity to ADAS and infotainment.

No timeline was given for the transfer of the bump and sort facilities

“GF remains committed to growing our European manufacturing ecosystem to support local and global customers, especially in the automotive markets. This partnership with Amkor in Portugal will provide much needed services within the EU and expand the US-European semiconductor supply chain,” said Mike Hogan, GlobalFoundries’ Chief Business Officer, in a statement.

“Amkor’s collaboration with GF enables us to significantly expand manufacturing scale and bring to market additional assembly and test capability to support our European and global customers,” said Kevin Engel, an Amkor executive vice president, in the same statement.

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