Gold-plated bondable resistors optimize heat dissipation

Gold-plated bondable resistors optimize heat dissipation

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By eeNews Europe

The Isa-Plan process uses pressure bonding to combine three layers of manganin foil, copper substrate with an adhesive to provide good thermal conductivity.

A small increase in the temperature of the component has a positive effect on stability and long-term drift. Both resistors are well suited to applications in the automotive sector in which there are requirements in terms of high temperature and load. The devices meet the international AEC-Q200 specifications. The PMH-D and PLU can also be used in industrial applications such as frequency converters and power modules with DCB ceramic substrates.
The PMH-D (6.7 x 3.4 x 0.7 mm) and the PLU (10.4 x 6.4 x 0.6 mm) are designed for hybrid mounting with bonding technology. The bonding pads and the back side of the component are plated with a 0.1 μm layer of gold which makes soldering and mounting with conductive adhesive viable.

The resistors are designed to handle a constant load of up to 5 W at 150°C and a constant current of up to 50 A (PMH-D / size 2512) and 70 A (PLU / size 3924). The PMH-D is currently available as a 2-mOhm resistor and the PLU as a 1-mOhm resistor. Both resistors are designed as four-wire measurement resistors (Kelvin connection) and fulfil the requirements of RoHS guideline RoHS 2011/65/EU.

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