Gold-plated capacitor termination secures 200C operation
Gold terminations were developed to accommodate mission critical, high reliability and high temperature applications where the use of pure tin and tin-lead plating may compromise long term performance and RoHS initiatives, respectively. Available on surface mount HT 200 degrees C Series and HV-HT 200 degrees C Series C0G dielectric product families, gold terminations eliminate concerns associated with high temperature reliability as well as long term storage. Thickness offerings range from 1.97 micro-inch to greater than 100 micro-inch. These options facilitate assembly by wire bonding, conductive adhesive (epoxy bonding) as well as most soldering attachment methods while ensuring improved long term performance and reliability.
Kemet; www.kemet.com/Hi-Temp-Ceramic
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