Gold remains strong in electronics with record demand in 2010
Growth in semiconductor fabrication demand was recorded in most key markets, led predominantly by East Asia. China and Taiwan were the frontrunners, with growth of over 10% as demand for semiconductors used in automotive, personal, and household appliances grew. Of particular note were gains for mobile and smart phones, netbooks, notebooks and tablets. Demand in Japan was hampered by the earthquake and tsunami, which resulted in widespread closures of semiconductor fabricators producing chips, components, and other electronics materials.
While the growth witnessed in early 2010 was driven by replenishment of inventory supply lines, demand in the second half of 2010 and into 2011 has been driven by economic recovery and improving consumer sentiment. Gold is used inside electronic devices in a number of forms including gold bonding wire, electroplated gold contacts and connectors, gold-tin solder alloys, thick film gold pastes and metallised gold coatings.
According to Richard Holliday, Director of Technology at the World Gold Council, this record year for gold demand shows that despite the aggressive promotion of cheaper alternatives such as copper for the wire bonding packaging solutions and non-gold contact finishes, gold remains the metal of choice for manufacturers looking for durability and reliability in component manufacturing.
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