Goodix teams for Apple-compatible smart trackers
Leading Chinese chip maker Goodix Technology, which bought Dream Chip in Germany, has teamed up with Tuya Smart on smart trackers for the Internet of Things (IoT) that are compatible with Apple devices.
The design uses GR551x series Bluetooth Low Energy SoC to support Apple’s “Find My”, enabling object finding among various Apple devices by simple settings.
The latest Bluetooth Special Interest Group (SIG) report shows annual shipments of Bluetooth asset tracking devices are expected to reach 128 million in 2022 and increase fourfold in the next five years.
The GR551x family is a single-mode, low-power Bluetooth 5.1 System-on-Chip (SoC). It can be configured as a Broadcaster, an Observer, a Central, or a Peripheral and supports the combination of all the above roles, making it an ideal choice for Internet of Things (IoT) and smart wearable devices.
It is based on ARM Cortex-M4F CPU core, the GR551x integrates Bluetooth 5.1 Protocol Stack, a 2.4 GHz RF transceiver, up to 526KB of on-chip programmable Flash memory, RAM, and multiple peripherals in a 3.5 x 3.5 mm BGA package with a 0.6mm pitch.
Related articles
- China’s Goodix completes acquisition of Dream Chip
- Fingerprint Cards sues China’s Goodix over patent
- Chinese IoT firm Tuya raises $200m
“Next, Tuya and Goodix will cooperate more extensively on smart homes, smart industries, smart fitness, and energy management based on our strengths,” said Daisy Yang, Director of Smart Travel Solution from Tuya.
“Together with Tuya Smart, we are going to create easier and more efficient product development solutions for diversified intelligent applications,” said Mohy Abdelgany, General Manager of Connectivity BU from Goodix, “We will continuously leverage our wireless connectivity technologies to create more smart scenarios for the IoE (Internet of Everything) ecosystem. With that, we can empower various industries in developing innovative applications that bring global consumers a safer and more convenient life.”
www.goodix.com
Other articles on eeNews Europe
- US restricts wide bandgap materials and EDA tools for 3nm chips
- Intel sells off massive patent portfolio
- Microchip to develop next generation 12 core RISC-V space processor for NASA
- 48 core neuromorphic AI chip uses resistive memory
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
