Graphene filled epoxy boasts 5.5W/(m•K) thermal conductivity
EP30NG achieves an extraordinary thermal conductivity of 5.5W/(m•K) at room temperature while its compressive strength measures 22,000-24,000 psi upon cure. It has a low coefficient of thermal expansion and exhibits a Shore D hardness of 85-95. Minimum bond line thickness is 0.18mm, since graphene nanoparticles tend to agglomerate to form larger particles. EP30NG bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics.
Master Bond – www.masterbond.com